18–26 Sept 2025
Ito International Research Center
Asia/Tokyo timezone

Cold spray additive manufactured copper as substrate for thin film-SRF cavities

THP25
25 Sept 2025, 14:30
3h
Ito International Research Center

Ito International Research Center

Tokyo
Board: THP25
Poster Presentation MC3: Cavities Thursday Poster Session

Speaker

Fritz Motschmann (Commissariat à l'Energie Atomique)

Description

Recent advances in additive manufacturing promise interesting possibilities for the design and fabrication of superconducting radio frequency (SRF) cavities. Cold Spray Additive Manufacturing (CSAM) is one candidate that would allow for rapid built times, realization of integral cooling structures, deposition of different materials and an easy upscaling with available equipment. As it is the case for any present AM-method, we need to address limitations and challenges regarding microstructure and surface quality of the built material towards an actual application. This work focuses on the experimental analysis of pure copper manufactured by CSAM regarding their mechanical, microstructural and physical properties that are key for the operation of SRF-cavities. The present state of the art cold sprayed copper demonstrates a dense microstructure with a low defect density. Residual resistance ratios and mechanical properties in the range of the specifications of conventionally used oxygen-free copper can be obtained with adequate post-heat treatments. Special attention is also paid to the condition and possible improvement routes for the RF-facing surface of CSAMed copper cavities.

I have read and accept the Privacy Policy Statement Yes

Author

Fritz Motschmann (Commissariat à l'Energie Atomique)

Co-authors

Bertrand Baudouy (Commissariat à l'Energie Atomique) Christophe Verdy (Université de technologie de belfort-montbéliard) Fabien Eozénou (Commissariat à l'Energie Atomique) Thomas Proslier (Université Paris-Saclay)

Presentation materials

There are no materials yet.