Speaker
Description
High-energy electron beams operating in accelerator vacuum chambers can easily cause heat accumulation on the surfaces of in-vacuum components. When convective cooling and effective conductive heat dissipation are limited, the thermal radiation capability of material surfaces becomes an important heat dissipation mechanism. In this study, copper oxide (CuO) thin films were deposited on Oxygen-Free Copper (OFC) substrates to investigate their enhancement of surface thermal radiation char-acteristics. Experimental results show that the prepared CuO films exhibit dense columnar grain structures with a monoclinic CuO (002) preferred orientation. Emissivity measurements indicate that the average high-temperature emissivity of bare OFC substrates is approximately 0.1, while CuO-coated samples can achieve values up to 0.52, demonstrating improved infrared thermal radiation performance. The coating system setup, experimental procedures, and emissivity measurement methods will be fur-ther described in this paper.
| Paper status | Resubmitted proceeding files received and assigned to an editor. Accepted. |
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