16–21 Aug 2026
Daejeon Convention Center
Asia/Seoul timezone

Microscopic Hydrodynamic Mechanisms of Bubble-Induced Pitting and Surface Optimization in Niobium Electropolishing for SRF Cavities

Not scheduled
2h
Daejeon Convention Center

Daejeon Convention Center

107 Expo-ro, Yuseong-gu, Daejeon (34125) South Korea
Poster Presentation MC4.A08: Superconducting RF Poster Session

Speaker

Xiaohu Wang (ShanghaiTech University)

Description

Electropolishing (EP) is a critical surface treatment for pushing the performance limits of superconducting radio-frequency (SRF) cavities in modern CW accelerators. However, localized pitting defects caused by hydrogen bubble stagnation remain a major limiting factor. In this work, we established a scalable, circulation-free beaker EP setup utilizing magnetic stirring and external water-bath thermal control. Initial experimental results demonstrate the in-situ nucleation of hydrogen bubbles on the Nb anode surface rather than mechanical migration from the Al cathode. Hydrodynamic analysis indicates that macroscopic fluid shear in low flow rate is insufficient to overcome the capillary adhesion of micro-bubbles. By optimizing fluid dynamics and applying a duty-cycle voltage, this highly simplified approach successfully yielded ultra-smooth Nb surfaces with a roughness of Ra∼50 nm, proving its efficacy for fundamental mechanistic studies.

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Author

Xiaohu Wang (ShanghaiTech University)

Co-authors

Jinfang Chen (Shanghai Advanced Research Institute) Yue Zong (Shanghai Advanced Research Institute) Zheng Wang (Shanghai Institute of Applied Physics)

Presentation materials

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