Speaker
Description
Conformal deposition of high-performance superconducting films on complex cavity geometries, particularly ensuring robust film-substrate adhesion, remains a fundamental challenge. We address this by introducing a novel high-power impulse magnetron re-sputtering and sputtering (HiPIMRS) system designed for uniform niobium (Nb) film deposition on the interior surfaces of 1.3 GHz copper cavities. A key innovation is an in-situ copper substrate re-sputtering step prior to Nb deposition, which eliminates interfacial oxides and degradation, ensuring atomic-scale interfacial integrity. Through in-situ re-sputtering prior to deposition, we achieve oxide-free Nb/Cu interfaces with atomic-scale integrity. Crucially, electrical transport measurements demonstrate a significant enhancement in the superconducting transition temperature from 8.5 K to 9.3 K for HiPIMRS films, along with smooth surfaces (Rₐ < 20 nm) and a preferred (110) orientation. This work establishes HiPIMRS as a viable pathway for next-generation superconducting radiofrequency (SRF) cavity production, with its interfacial engineering protocols offering significant advancements in film conformity and superconducting properties.
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