7–12 May 2023
Venice, Italy
Europe/Zurich timezone

Anodic bonding of silicon and glass for bent monochromator

THPM028
11 May 2023, 16:30
2h
Sala Mosaici 2

Sala Mosaici 2

Poster Presentation MC7.T35: Advanced Manufacturing Technologies for Accelerator Components Thursday Poster Session

Speaker

Wei-Yang Lai (National Synchrotron Radiation Research Center)

Description

Anodic bonding technology is a method which mainly by the aid of the electric field and temperature for connecting two materials such as glass-glass or glass-silicon wafer substrate by forming covalent bonding. The bent monochromator used in the synchrotron radiation which was made by high quality silicon wafer bonded onto concave cylindrical shape Pyrex glass base. In the past, it is made by gluing. The anodic bonding method for fabricating the bent monochromator which has more advantages than bonding by glue, such as tight bonging, non-intermediate, and simple process. This paper describes the detailed manufacturing processes and testing results.

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Primary author

Chun-Shien Huang (National Synchrotron Radiation Research Center)

Co-authors

Bo-Ying Chen (National Synchrotron Radiation Research Center) Chien-Kuang Kuan (National Synchrotron Radiation Research Center) Wei-Yang Lai (National Synchrotron Radiation Research Center) Tse-Chuan Tseng (National Synchrotron Radiation Research Center) Huai-San Wang (National Synchrotron Radiation Research Center)

Presentation materials

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