10–15 Aug 2025
SAFE Credit Union Convention Center
America/Los_Angeles timezone

Progress report on two-bunch excitation of wakefield in dielectric structures

WEP049
13 Aug 2025, 16:00
2h
Ballroom A (SAFE Credit Union Convention Center)

Ballroom A

SAFE Credit Union Convention Center

Poster Presentation MC3 - Novel Particle Sources, Acceleration Techniques, and their Applications Wednesday Poster Session

Speaker

Calcifer Phillips (Northern Illinois University)

Description

Wakefield accelerators have the potential to achieve accelerating fields in the GV/m range, offering a promising path to more compact and cost-effective acceleration compared to conventional methods. Structure-based wakefield accelerator (SWFA) technology provides a viable approach to implementing beam-driven wakefield acceleration. An experiment at the Argonne Wakefield Accelerator (AWA) will utilize dielectric-lined structures to explore multi-beam excitation of wakefields for wakefield-pulse shortening and mapping of the transverse wakefield topology. These structures were commercially sourced and require a thin metallic film deposited on their outer surface. The first part of this paper summarizes the preparation of these structures. In parallel, a two-bunch beam configuration is required to support the experimental investigation, where one bunch excites the wakefield and the second serves as a loading or probe bunch. The experimental generation and testing of this two-bunch scheme at AWA are presented in this work.

Funding Agency

U.S. DOE Contract No. DE-AC02-06CH11357 with ANL and  award No. DE-SC0022010 to NIU.

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Author

Calcifer Phillips (Northern Illinois University)

Co-authors

Brendan Leung (Northern Illinois University) Edgar Gomez (Euclid Techlabs (United States)) Eric Wisniewski (Argonne National Laboratory) John Power (Argonne National Laboratory) Liliana Stan (Center for Nanoscale Materials) Philippe Piot (Argonne National Laboratory) Scott Doran (Argonne National Laboratory) Xueying Lu (Northern Illinois University)

Presentation materials

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