Speaker
Description
Liquid metals as thermal interface materials (TIMs) offer ultrahigh contact thermal conductance while their inherent compliance eliminates clamping stress-induced deformation in optical components, such as InGa bath or InGa gap cooling. However, their corrosivity toward metals (e.g., Cu, Al) necessitates protective coatings such as high-phosphorus electroless nickel (Ni-P), though minor corrosion persists during prolonged baking operation. To investigate the correlation between corrosion behavior and baking conditions (80~150 ℃/14 days), we developed an in situ measurement system for liquid metal thermal contact conductance. The setup employs a square-waved heating excitation method to monitor transient temperature responses (peak values, PV), coupled with finite element modeling, to quantify interfacial thermal conductance degradation. This work provides critical insights into thermochemical reliability for liquid metal cooling solutions in high-heat-load synchrotron optics.
