Study of PLC hardware integration within the CERN controls environment

WEPD040
24 Sept 2025, 16:30
1h 30m
Palmer House Hilton Chicago

Palmer House Hilton Chicago

17 East Monroe Street Chicago, IL 60603, United States of America
Poster Presentation MC10: Software Architecture & Technology Evolution WEPD Posters

Speaker

Mr Christophe Boucly (European Organization for Nuclear Research)

Description

In view of the consolidation of the LHC Beam Dumping System (LBDS) control planned during CERN Long Shutdown 3 (LS3), a study was conducted to evaluate industrial Ethernet-based protocols to simplify the current multi-fieldbus architecture connecting PLCs and distributed I/O. Initial assessments used the 32-bit PROFINET driver as an alternative communication interface between the Front-End Software Architecture (FESA) and PLCs, reducing system complexity and enhancing flexibility to adapt to new data acquisition needs without recompilation. While early results were promising, limitations arose from the 32-bit kernel’s integration into CERN’s middleware. The release of a new SIEMENS® PROFINET driver based entirely on libraries now enables 64-bit integration on Debian 12 systems. This development offers new possibilities for interfacing the Slow-Control and Surveillance System (SCSS) of the LBDS, using PROFINET ring communication. This paper evaluates the performance and deployment scenarios of industrial protocols (Open User Communication, SIEMENS® SOFTNET, and OPC UA) within CERN’s control infrastructure. It compares them with the existing system design and highlights the initial operational results of the PROFINET driver integration within SCSS on the Beam Transfer kicker test bench.

Author

Mr Christophe Boucly (European Organization for Nuclear Research)

Co-authors

Colin Monier (European Organization for Nuclear Research) Nicolas Magnin (European Organization for Nuclear Research) Omer Yusuf Yagci (European Organization for Nuclear Research) Thomas Oulevey (European Organization for Nuclear Research)

Presentation materials

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