Speaker
Vijay Chouhan
(Fermi National Accelerator Laboratory)
Description
Mechanical grinding is commonly employed to eliminate surface defects such as scratches and pits from niobium cavity surfaces or sheets before cavity fabrication. Subsequently, chemically buffered polishing or electropolishing is often utilized to completely remove residues of the polishing media and any defects induced by mechanical grinding, ensuring a pristine surface. In this study, we conducted a systematic investigation to assess the influence of mechanical grinding using silicon car-bide and aluminum oxide polishing media on niobium surfaces. Additionally, the study examines the effects of post-mechanical grinding chemical treatments on surface quality.
Author
Vijay Chouhan
(Fermi National Accelerator Laboratory)
Co-authors
Davida Smith
(Fermi National Accelerator Laboratory)
Genfa Wu
(Fermi National Accelerator Laboratory)
Tim Ring
(Fermi National Accelerator Laboratory)
