Speaker
Description
At the Paul Scherrer Institute (PSI), nanotechnology has been successfully employed to develop minimally invasive Wire Scanners with sub-micrometer spatial resolution for monitoring the transverse beam size at SwissFEL during lasing operation. The devices consist of a monolithic low-stress Si₃N₄ structure with a C-shaped silicon fork, integrating two perpendicular wires for full transverse beam profile reconstruction. The wires are as small as 2 µm in width and 1 µm in thickness; their length complies with the SwissFEL beam clearance.
This contribution presents dedicated beam tests performed under standard operating conditions at SwissFEL. For the first time, the results demonstrate a reliable WS operation fully compatible with machine protection constraints, with a negligible impact on lasing delivery.
A systematic comparison in terms of beam invasiveness is carried out against conventional wires of different material (tungsten, CNT) and diameter. The results show a substantial reduction in beam perturbation when using Si₃N₄ wires, confirming their suitability for FELs and marking a significant step toward truly non-destructive transverse beam diagnostics.
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