7–11 Sept 2025
Teaching Hub 502
Europe/London timezone

Development of Novel, Radiation-Hard, Ultra-Compact Active Beamstops with Integrated X-ray Sensors for Scattering Experiments on High-Brilliance Undulator Beamlines

WEPCO20
10 Sept 2025, 16:00
2h
Teaching Hub 502

Teaching Hub 502

The University of Liverpool 160 Mount Pleasant L3 5TR Liverpool
Poster Presentation MC03: Beam Position Monitors WEP

Speakers

Gabriele Trovato (University of Catania, Institute for Microelectronics and Microsystems, Istituto Nazionale di Fisica Nucleare, Sezione di Catania, STLab srl) Massimo Camarda (Institute for Microelectronics and Microsystems, STLab srl, SenSiC GmbH)

Description

SenSiC GmbH, a spin-off from the Swiss Light Source (SLS), has developed a new class of beamstopper sensors, termed Beamstopper Integrated Sensors (BIS)[1,2], based on Silicon Carbide (SiC) semiconductor technology. Using custom processing and assembly methods, BIS devices achieve ultra-compact footprints below 1 mm and are designed for both real-time intensity monitoring and four-quadrant beam position sensing. The choice of SiC enables extreme radiation hardness and intrinsic insensitivity to visible light, enhancing sensitivity and signal fidelity by suppressing stray light contributions. BIS sensors have been successfully validated in operational environments: intensity-monitoring devices were tested at the SLS, while position-sensitive variants were deployed at MaxIV. These results demonstrate the robustness and precision of the BIS technology, offering a compact, radiation-resistant solution for integrated beam diagnostics in high-brilliance synchrotron beamlines.

Footnotes

  • P. J. Ellis et al. J. Synchrotron Rad. (2003). 10, 287
    ** C. E. Blanchet et al. J. Synchrotron Rad. (2015). 22, 461
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Authors

Gabriele Trovato (University of Catania, Institute for Microelectronics and Microsystems, Istituto Nazionale di Fisica Nucleare, Sezione di Catania, STLab srl) Kim nygard (MAX IV Laboratory) Massimo Camarda (Institute for Microelectronics and Microsystems, STLab srl, SenSiC GmbH)

Co-authors

Daniel Grolimund (Paul Scherrer Institute) Dario Sanchez (Paul Scherrer Institute) Mario Birri (Paul Scherrer Institute) Niccolò La Rosa (Paul Scherrer Institute) Oliver Bunk (Paul Scherrer Institute) Samuele Moscato (University of Catania, STLab srl)

Presentation materials

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