1–6 Jun 2025
Taipei International Convention Center (TICC)
Asia/Taipei timezone

Development of robust beam window by additive manufacturing

THPB050
5 Jun 2025, 15:30
2h
Exhibiton Hall A _Bear (TWTC)

Exhibiton Hall A _Bear

TWTC

Poster Presentation MC7.T35 Advanced Manufacturing Technologies for Accelerator Components Thursday Poster Session

Speaker

Shunsuke Makimura (High Energy Accelerator Research Organization)

Description

Construction of the COMET experimental facility is underway to explore the muon-electron conversion process at the J-PARC Hadron facility. An 8 GeV proton beam supplied from the main ring irradiates a target in a superconducting capture solenoid magnet, and the produced pions and muons are transported to the experimental area. In the beam line, the muon transport solenoids are composed of superconducting magnets cooled by liquid Helium (LHe). The beam windows should be robust enough to withstand against rapid and high pressure increase in emergency of LHe quenching until rupture disks break. Simultaneously, the density of the beam window material must be low, and the thickness must be as thin as possible, while minimizing the beam energy loss for high transmission efficiency. Therefore, we have been developing a beam window built by additive manufacturing. We have successfully developed a beam window made of Ti-6Al-4V with a diameter of 269 mm, a thickness of 0.5 mm, and a proof pressure of 30 atm, and have now started development of a beam window made of AlSi10Mg.
In this presentation, we will report on the development status of the beam window by additive manufacturing.

Region represented Asia
Paper preparation format Word

Author

Shunsuke Makimura (High Energy Accelerator Research Organization)

Co-authors

Kenta Kurihara (Metal Technology Co.Ltd) Masakazu Takahashi (Metal Technology Co.Ltd) Yoshinori Fukao (High Energy Accelerator Research Organization) Masato Yoshida (High Energy Accelerator Research Organization) Yutaka Nagasawa (Metal Technology Co. Ltd.) Masahiro Onoi (Metal Technology Co. Ltd.)

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