1–6 Jun 2025
Taipei International Convention Center (TICC)
Asia/Taipei timezone

Development of C-band compact accelerating structure made of longitudinally-split two halves

WEPS065
4 Jun 2025, 16:00
2h
Exhibiton Hall A _Salmon (TWTC)

Exhibiton Hall A _Salmon

TWTC

Poster Presentation MC7.T06 Normal Conducting RF Wednesday Poster Session

Speaker

MASASHI KIMURA (Mitsubishi Heavy Industries Machinery Systems, Ltd.)

Description

Our 6 MeV medical C-band accelerating structure is assembled using the disk-stacked method, where multiple oxygen-free copper components are stacked along the beam axis. The design incorporates the side-coupled (SC) structure and the re-entrant structure with an accelerating gap at the center of the cavity. Due to the complex shape and the large nunber of components, there are challenges in manufacturing efficiency. On the other hand, the longitudinally-split method divides the structure along a plane passing through the beam axis, independent of the number of cells, which significantly reduces the number of components. Based on the longitudinally-split X-band accelerating structure developed in the CLIC project, we have been working on the development of a compact, high-gradient, high-shunt impedance, longitudinally-split SC-type C-band accelerating structure. In this presentation, we will report the progress of our work, including manufacturing, RF testing, frequency tuning, and beam testing in the actual operating conditions.

Region represented Asia
Paper preparation format Word

Author

MASASHI KIMURA (Mitsubishi Heavy Industries Machinery Systems, Ltd.)

Co-authors

Tomei Sugano (Mitsubishi Heavy Industries Machinery Systems, Ltd.) Nobuyuki Shigeoka (Mitsubishi Heavy Industries Machinery Systems, Ltd.) Hiroshi Hara (Mitsubishi Heavy Industries Machinery Systems, Ltd.) Kyusaku Higa (Mitsubishi Heavy Industries Machinery Systems, Ltd.) Tetsuo Abe (High Energy Accelerator Research Organization) Toshiyasu Higo (High Energy Accelerator Research Organization)

Presentation materials

There are no materials yet.