Speaker
Description
To enhance the performance of superconducting radiofrequency (SRF) cavities, a promising solution involves depositing a superconducting material onto copper RF cavities. A prerequisite for this process is the electropolishing of the copper cavities. At Jefferson Lab (JLab), a modeling study of the electropolishing process for 1.3 GHz copper cavities was conducted. This paper focuses on two main aspects. First, the characterization of the electropolishing solution, consisting of H?PO? and n-butanol, was carried out through chemical and electrochemical analyses. This enabled the development of a comprehensive surface preparation process for the electropolishing of copper cavities, which involved defining all critical parameters such as voltage, temperature, and electrolyte flow.Second, these parameters were used as inputs for COMSOL simulations to optimize the electropolishing process. The simulations incorporated modules for secondary current density, heat transfer, and laminar flow to refine the cathode shape and enhance the process efficiency
| Region represented | America |
|---|---|
| Paper preparation format | Word |
